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UV curing etching resist ink for acidic etching solution
(KSM-UV 201)
KSM-UV 201 is UV curing etching resist ink for acidic etching solution, which is used for making patterns on copper-clad laminates by means of acidic etching. The cured film can provide good adhesion, clear printing line, high resolution , resistance to the etching of acidic CuCl2/FeCl3 solution and fast removing coating.
Properties of Ink
Items
Technical features
Notes
Color
Blue
Fineness
≤8µm
0 ~25µm Fineness gauge
Viscosity (25?)
160±20dPa?s
VT-04F
Density (25?)
1.10 ~1.30 g/ml
Screen mesh
100 ~120T
Film thickness
10 ~12µm
Curing energy
1200 ~2000 mJ/cm2
The effective value through the polyester film
Pencil hardness
≥2H
Pencil hardness test
Adhesion
100/100
Laceration experiment
Etching resistance
FeCl3 or CuCl2 acidic solution
45±5?
Moving coating
3~5% NaOH solution ,20~40s
25~35?
Package
5.0 kg/bucket , 20 kg/box
Shelf time
6 months since the date of manufacture
Store below 25? in dark
Attention :
1. Mixing the ink fully before using.
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