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Electrically insulating and heat-conducting silicone substrate, with the addition of aluminum nitride. For mounting heat sinks on heat-generating electronic components. Thickness 2 mm, sheet 400 x 200 mm.
It is used to ensure good heat transfer between the heat-generating component (processor, micro-assembly, LED) and the heatsink.
Also has dielectric properties, electrically isolating the heat sink from the component.
The silicone base gives the material high elasticity, the backing fills well the microrelief of the mating surfaces.
Aluminum nitride, which has excellent thermal conductivity, is used as a filler.
Characteristics:
thickness: 2mm
sheet size: 400 x 200 mm
thermal conductivity: 1.5W/mK
dielectric constant: 4.5 kV/mm
operating temperature range: -50°C+200°C
linear elongation ratio: 1.48
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