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Solder in bars JF- Sn63Pb37 [480g, stick] with antioxidants
Solder Sn63/Pb37, 183°C, without flux, but with antioxidant additives. 480 g ingot For crucibles, static soldering pots and dip soldering. Pure first heat.
Solder for electronics with the composition of the alloy Sn63/Pb37 (POS-61) is made from a mixture of 63% tin and 37% lead. This ratio of metals in the alloy is eutectic.
This solder is produced only from the metals of the first heat.
Being eutectic, this solder alloy has no melting ductility range.
This type of solder is one of the most convenient to work with due to its low melting point of 183ºC and a narrow melting/solidification region, resulting in strong solder joints that are highly resistant to solder whisk.
In most cases, this alloy flows better than Sn60/Pb40 and is preferred for repair, installation and rework of lead-out and surface-mounted components.
This solder meets or exceeds the requirements of domestic and foreign standards.
Solder in bars is made with the addition of special antioxidants, which makes it possible to obtain solder joints with a low content of oxides, which is very important for use in wave and immersion soldering installations.
Characteristics:
alloy composition: Sn (tin) - 63%, Pb (lead) - 37%
melting point: 183°C
ingot shape: bar
net weight, gram: 480 ±3%
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The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
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The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
